Micropelt GmbH is a company that manufactures and sells thin-film thermoelectric (TE) products. The company has revolutionized the way of fabricating miniaturized thermoelectric devices that offer extraordinary growth opportunities in a variety of exciting and emerging applications by using wafer based batch production processes. Focus markets are power generation through waste heat recovery for wireless sensor networks, rapid cooling and heating systems for industrial and life science applications, miniaturized and low cost laser cooling products as well as chip spot cooling.

Significant business and technology milestones have been achieved, design-in and proof-of-concept work with major key accounts are in progress.

 

Expertise / Previous Experience:

The company, founded as a spin-off from Infineon Technologies in January 2006, is the result of more than 8 years of research and development funded and led by Infineon Technologies and it’s research partner, the Fraunhofer Institute for Physical Measurement (IPM). The company’s pilot line is located in Freiburg, Germany, with 20 employees. End 2010 a first production site in Halle an der Saale, Germany, with a yearly capacity of up to million devices per year, will be available.

The management has more than 50 years experience in international semiconductor business. All assets and intellectual property rights including know-how and 6 patent families, are transferred to and belong to Micropelt.

 

Staff Members Profile

Dr. Joachim Nurnus received his Dr.rer.nat. degree (PhD) from Albert-Ludwigs-Universität Freiburg, Germany, in 2001. In 1997 he started research at the Fraunhofer IPM institute in Freiburg, focusing the fields of IV–VI and V–VI based semiconductors for use in thermoelectric and optoelectronic low dimensional structures. In 2006 he became a co-founder of Micropelt GmbH. As a member of the management team he still heads technology development and project management. He has more than 50 publications in conference proceedings, journals as well as books related to thermoelectrics, and holds multiple patents.

Axel Schubert received the Diploma degree in physics from the Technische Universität München, Germany, in 1985. Since then, he first worked at the semiconductor division of Siemens and is now with Infineon. His main topics are silicon applications for optoelectronics and functional layers on silicon. Since 2006 he is with Micropelt GmbH. As a member of the management team he is responsible for the product definition and intelectual property management. He has more than 10 publications in conference proceedings, is author of two chapters in thermoelectrics related books and holds several patents.

Michael Woda, received his physics Diploma degree at RWTH Aachen, Germany, in 2006 and his Master of Physics degree in optoelectronic and lasers at Heriot Watt University Edinburgh, United Kingdom in 2005. From 2005 – 2010 he has been working in the field of thin film Sb and Te based phase change materials at RWTH Aachen. During a research stay at Philips, High-Tech campus Eindhoven, Netherlands, in 2006, he worked on PCRAM devices. Since 2011 he is working as a development engineer at Micropelt GmbH, focusing on thin film deposition and analysis at the production site in Halle (Saale), Germany.

Benjamin Bennemann received his engineer of applied sciences degree in 2005. After his studies of micro system technologies at Luebeck University of Applied Sciences he worked at the Fraunhofer IPM in Freiburg focusing in deposition and optimization of V–VI based semiconductors. Since 2006 he is a member of the research and developing team he is responsible for sputter deposition and analytics. ic
 i�AX�� is member of innovative concepts team. He has 15 years experience in semiconductor packaging and related technologies. Since 10 years he is working in the field of power electronics packaging.

Andreas Mahlke received his engineer of Applied Sciences from University of Applied Sciences Brandenburg,Germany, in 2002. In 2002 he started research at the Fraunhofer IPM institute in Freiburg, focusing the fields of V–VI based semiconductors for use in thermoelectric low dimensional structures. Since 2006 he is a member of theengineer team in the R&D responsible for optimization and analytics of thermoelectric materials.