With over 250 scientists the Fraunhofer IZM Berlin is one of the leading institutes in the field of microelectronics and system integration worldwide. It deals with fundamental research as well as with the development of methods, processes and technologies. Specific Profile and Expertise with respect to the following key competencies: Of the Fraunhofer IZM competencies in technology and materials characterisation as well as in simulation will be involved. As a philosophy, simulations are always accompanied by experiments and analytical techniques for process development. On the technology side, the F-IZM has longstanding experience with wafer level packaging, including thin film technology, coating and electroplating, as well as material synthesis and process development. In the area of interconnection technologies F-IZM has strong experience in fluxless micro-soldering, thermocompression, thermosonic and diffusion bonding as well as in ageing and degradation behaviour of interconnects. On the analytical side, there is expert knowledge in reliability studies by both simulation (FEM) and experiments (materials testing, micro and nano analytical methods) on bulk and interface level for thermal and thermo-mechanical characterisation. The F-IZM looks back on many successful projects in design of reliable advanced thermal management solutions.

Staff Members Profile

Dr. Olaf Wittler studied physics in Paderborn, London and Berlin. After receiving his Diploma degree in 1999 he worked for his Ph.D. thesis at Bosch GmbH and Fraunhofer IZM on fracture mechanics in plastic encapsulants. Since 2002 he worked at the Technical University of Berlin on different projects in the field of thermomechanical reliability, material characterization and thermal CFD simulation on national and international level addressing public funded research as well as direct industry research and consulting. In 2006 he joined the Fraunhofer IZM. Since 2010 he is head of the Micro Materials Center Department of Fraunhofer IZM in Berlin, Germany. He is in charge of the main developments with respect to thermal and thermo-mechanical reliability.

Dr. Hermann Oppermann studied Materials Science and Technology at the Technical University in Clausthal and received the Doctor degree in Materials Science at the Metals Research Institute of the Technical University Berlin. Since 1993 he has been with the Microperipheric Center of the TU Berlin, and was working in flip chip and CSP packaging technology. Between November 1998 and May 1999 he joined the Institute of Microsystem and Advanced Packaging Laboratory at the University of Tokyo as Associated Professor. Since 2000, he is managing the group “Interconnect Metallurgy & Processes” and he is experienced in interdisciplinary projects related to the integration of Power, MEMS, Opto and RF circuits. His main research interest is metallurgy and reliability.

Dr. Michael Töpper has a M.S. degree in Chemistry (University of Karlsruhe) and a PhD in Material Science from Technical University of Berlin. Since 1994 he is with the Packaging Research Team of TU Berlin and Fraunhofer IZM. In 1999 he became head of a research group at Fraunhofer IZM. Since 2006 he is also a Research Associate Professor of Electrical and Computer Engineering at the University of Utah. The focus of his work is Wafer Level Packaging applications with a focus on materials.

Prof. Dr. Bernhard Wunderle studied Physics in Tübingen/Germany, York/England and Salerno/Italy. In 1998 he received his diploma in theoretical physics from the University of Tübingen. From 1999 on he was with Robert Bosch Ltd, where he was concerned with reliability studies in advanced electronic packaging for automotive applications, a work he received his Ph.D. in electronic engineering for from the Technical University of Berlin in 2003. At Fraunhofer he currently leads a group working in the field of material characterisation and reliability in experiment and simulation. He gives lectures at various universities in Germany. His interests and expertise lie with Finite Element modelling, molecular modelling, fracture mechanics and adhesion, nanolayers and nanocomposites. He is also a full professor for materials and reliability at the Technical University of Chemnitz. He has a vast experience as project or work-package leader in many European and national projects.

Contact Address

Bernhard Wunderle

Prof. Dr.-Ing.

Lehrstuhl Werkstoffe und Zuverlässigkeit Mikrotechnischer Systeme

Fakultät für Elektrotechnik und Informationstechnik

Technische Universität Chemnitz

Reichenhainer Str. 70

D-09126 Chemnitz

Germany

Tel: +49 (0)371 531 38124

Sec: +49 (0)371 531 24450

Fax: +49 (0)371 531 24439

bernhard.wunderle@etit.tu-chemnitz.de

Abt. ERE & MMC

Fraunhofer IZM & ENAS

Volmerstrasse 9 B, 1. OG

D-12489 Berlin-Adlershof

Germany

Tel: +49 (0)30 6392 3613

Sec: +49 (0)30 6392 3610

Fax: +49 (0)30 6392 3617

bernhard.wunderle@izm.fraunhofer.de