Publications

  • “Templated Growth of Covalently Bonded Three-Dimensional Carbon Nanotube Networks Originated from Graphene”, Yifeng Fu, Björn Carlberg, Niklas Lindahl, Johan Bielecki, Aleksandar Matic, Yuxin Song, Zhili Hu1, Zonghe Lai, Lilei Ye, Jie Sun, Yahui Zhang, Yan Zhang, Johan Liu, Advanced Materials Volume 24, Issue 12, pages 1576–1581,2012
  • Invited paper “Acoustic and photonic devices based on micromachining and nanoprocessing of GaN/Si”, author Alexandru Muller, G Konstantinidis  presented at the First International conference “Micro&Nano 2012” on Micro - Nanoelectronics, Nanotechnologies and MEMS, Heraklion, 7-10 October 2012
  • Revised form of the paper "Residual stress distribution and deflection analysis of very thin GaN membrane supported devices" by A. Cismaru, A. Muller, G. Konstantinidis, et al. submitted to JMM ( IOP IF 2)
  • A paper regarding the new approach of the GaN/Si based thermal sensor will be submitted to the  Special Issue on "Last Trends in Acoustic Sensing" to be published in “Sensors” ( IF 1.75)
  • A Cismaru, A Muller, G Konstantinidis, F Comanescu, M Purica, A Stefanescu, A Stavrinidis, A Dinescu, A Moldoveanu, “Residual stress distribution and deflection analysis of very thin GaN membrane supported devices”.J. Micromech. Microeng. 23 (2013) 015010 (7pp)
  • Alexandru Müller and George Konstantinidis “Acoustic and photonic devices based on micromachining and nanoprocessing of GaN/Si”, 5th International Conference on Micro-Nanoelectronics, Nanotechnology and MEMS, Oct 2012, Heraklion, Greece (invited)
  • A. Muller, G. Konstantinidis, A. Dinescu, A. Stefanescu, A. Cismaru, I. Giangu, A. Stavrinidis, T. Kostopoulos, V. Buiculescu, “Novel high sensitivity GaN SAW based temperature sensor structures working in the GHz frequency range”, EMRS Spring 2013, Symposium L, Strasbourg, France
  • A. Cismaru, A. Muller, F. Comanescu, M. Purica, A. Stefanescu, A. Dinescu, “Morphological analysis of GaN membranes obtained by micomachining of GaN/Si” 2013 IEEE International reliability Physics Symposium, April 2013, Monterey, USA
  • A. Muller, G. Konstantinidis, A. Dinescu, V Buiculescu, A. Stefanescu, A. Cismaru, I. Giangu, G. Stavrinidis, A. Stavrinidis, “GHz operating GaN/Si SAW based temperature sensor”, submitted at MEMSWAVE 2013
  • Zandén, X. Luo, L. Ye, J. Liu, “A new solder matrix nano polymer composite for thermal management application”, Composite Science and Technology, 94 (2014) 54-61.
  • M. Murugesan, C. Zandén, X. Luo, L. Ye, V. Jokubavicius, M. Syväjärvi and J. Liu, “A Carbon fiber solder matrix composite for thermal management of microelectronic devices”, J. mater. Chem. C, 2 (2014) 7184-7187.
  • X. Luo, Y. Zhang, C. Zandén, M. Murugesan, Y. Cao, L. Ye and J. Liu, “Novel thermal interface materials: boron nitride nanofiber and indium composites for electronics heat dissipation application”, J. Mater. Sci., 25 (2014) 2333-2338.
  • Johan Liu, Yifeng  Fu, Di Jiang, "Chemically vapor deposited carbon nanotubes for Vertical electronics interconnect in packaging applications", International Conference on Solid-state Circuit and Integrated Circuit Technology, Oct 28 - 31 2014, Guilin, China, Invited talk.
  • Di Jiang, Shuangxi Sun, Wei Mu, Yifeng  Fu and Johan Liu, "Carbon Nanotube/Solder Hybrid Structure for Interconnect Applications", IEEE CPMT Electronics System Integration Conference (ESTC) 2014 Conference in Helsinki, Finland, Sept. 16 - 18, 2014, p.135.
  • Si Chen, Di Jiang, Lilei Ye and Johan Liu, "A Solder Joint Structure with Vertically Aligned Carbon Nanofibres as Reinforcements", IEEE CPMT Electronics System Integration Conference (ESTC) 2014 Conference in Helsinki, Finland, Sept. 16 - 18, 2014, p.189
  • Zoltan Sarkany, Marta Rencz, “Determination of the severity of thermal stress using model data calculated from thermal transient results”, In: Proceedings of 15th Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2014), 1-4 April 2014, Cannes, France
  • A. Muller, G. Konstantinidis, V. Buiculescu, A.Dinescu, A. Stavrinidis, A. Stefanescu, G. Stavrinidis, I. Giangu, A. Cismaru, A. Moldoveanu, “GaN/Si based single SAW resonator temperature sensor operating in the GHz frequency range”, Sensors and Actuators: A Physical 209 (2014) 115–123
  • A. Muller, G. Konstantinidis, I. Giangu1, V. Buiculescu, A. Dinescu, A. Stefanescu, A. Stavrinidis, G. Stavrinidis, A Ziaei “GaN-based SAW structures resonating within the 5.4-8.5 GHz frequency range, for high sensitivity temperature sensors” International Microwave Symposium -IMS 2014, 1-6 June, Tampa, USA, session “TH2F: Sensors and Sensor Systems »
  • A. Muller and G. Konstantinidis « Novel sensing devices based on micromachining and nanoprocessing of compound semiconductors», MEMSWAVE 2014, La Rochelle 1-2 July- invited
  • A. Müller, G. Konstantinidis, A. Dinescu, A. Stefanescu, A. Stavrinidis, V Buiculescu, A Ziaei  “Progress in manufacturing of GaN SAW devices resonating in the GHz frequency”, SMART SYSTEMS INTEGRATION 2014, Vienna, 26-27 March 2014, session “Advanced micro and nano technologies”
  • T. Kostopulous, A. Stavrinidis, I. Giangu, G. Stavrinidis, V. Buiculescu, A. Stefanescu, G. Konstantinidis, A. Muller, « Monolithic Integration of HEMT with Temperature SAW Based Sensor», MEMSWAVE 2014, La Rochelle 1-2 July
  • Alexandra Stefanescu, Antonis Stavrinidis, Valentin Buiculescu, Ioana Giangu, Franz Bechtold, Adrian Dinescu, George Stavrinidis, Thanasis Kostopoulos,  George Konstantinidis, Alexandru  Muller, "GaN/Si Acoustic Devices Towards Sensing Applications",  7th Wide Band Gap Semiconductor & Components Workshop Proceedings, pp. 299 - 302, 11 - 12 September 2014, ESA-ESRIN, Italy
  • A. Müller, G. Konstantinidis, A. Dinescu, V  Buiculescu, A. Stefanescu, A. Cismaru, I. Giangu, G. Stavrinidis, A. Stavrinidis, A. Ziaei “High sensitivity GaN SAW based temperature sensor structures working in the GHz frequency range” Therminic’13, Berlin, September 2013
  • A. Stefanescu, V. Buiculescu, A. Dinescu, A. Cismaru, A. Muller, G. Konstantinidis, A. Stavrinidis, G. Stavrinidis, "Modeling of SAW Resonators Fabricated on GaN/Si", IEEE Conference on Microwaves, Communications, Antennas and Electronic Systems – IEEE COMCAS 2013, Tel Aviv, Israel, 21-23 October 2013